Semiconductor Manufacturing Process Optimisation

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dc.contributor.authorKafumbe, Said
dc.date.accessioned2023-02-21T18:56:41Z
dc.date.available2023-02-21T18:56:41Z
dc.date.issued2018
dc.description.abstractIn a semiconductor manufacturing process the number of process steps as well as the time taken by each step are vital in determining the yield and volume of the manufactured device. Additionally, the manufacturing recipe used at each process greatly determines the reliability and performance of the finished design. By tweaking the process recipe as well as the process times an optimized manufacturing process can be obtained. This work presents process optimization at both the electroplating, cmp and plasma ashing steps for various semiconductor devices with improved performance for all devices.en_US
dc.identifier.citationKafumbe, S. (2018). Semiconductor manufacturing process optimisation. In 2018 Advances in Science and Engineering Technology International Conferences (ASET) (pp. 1-5). IEEE.en_US
dc.identifier.urihttps://nru.uncst.go.ug/handle/123456789/7923
dc.language.isoenen_US
dc.publisherIEEE.en_US
dc.subjectengineeringen_US
dc.subjectmathematicsen_US
dc.subjectexamplesen_US
dc.subjectproblemsen_US
dc.titleSemiconductor Manufacturing Process Optimisationen_US
dc.typeArticleen_US
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