A Literature Review on Sampling Techniques in Semiconductor Manufacturing

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dc.contributor.authorNduhura-Munga, Justin
dc.contributor.authorRodriguez-Verjan, Gloria
dc.contributor.authorDauz ´ ere-P ` er´ es, Stephane
dc.contributor.authorYugma, Claude
dc.contributor.authorVialletelle, Philippe
dc.contributor.authorPinaton, Jacques
dc.date.accessioned2023-08-09T10:28:05Z
dc.date.available2023-08-09T10:28:05Z
dc.date.issued2013
dc.description.abstractThis paper reviews sampling techniques for inspection in semiconductor manufacturing. We discuss the strengths and weaknesses of techniques developed in the last last 20 years for excursion monitoring (when a process or machine falls out of specifications) and control. Sampling techniques are classified into three main groups: static, adaptive, and dynamic. For each group, a classification is performed per year, approach, and industrial deployment. A comparison between the groups indicates a complementarity strongly linked to the semiconductor environment. Benefits and drawbacks of each group are discussed, showing significant improvements from static to dynamic through adaptive sampling techniques. Dynamic sampling seems to be more appropriate for modern semiconductor plants.en_US
dc.identifier.citationNduhura-Munga, J., Rodriguez-Verjan, G., Dauzere-Peres, S., Yugma, C., Vialletelle, P., & Pinaton, J. (2013). A literature review on sampling techniques in semiconductor manufacturing. IEEE Transactions on Semiconductor Manufacturing, 26(2), 188-195.https://doi.org/10.1109/TSM.2013.2256943en_US
dc.identifier.urihttps://nru.uncst.go.ug/handle/123456789/9128
dc.language.isoenen_US
dc.publisherIEEE Transactions on Semiconductor Manufacturingen_US
dc.subjectSemiconductor.en_US
dc.subjectControlen_US
dc.subjectSamplingen_US
dc.titleA Literature Review on Sampling Techniques in Semiconductor Manufacturingen_US
dc.typePresentationen_US
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